The Credit Institute of Canada invites HighRadius to exhibit at their Bi-Annual National Credit Conference
Quebec City – June 16, 2015 – HighRadius, the leading provider of Credit and Accounts Receivable automation solutions and the preferred choice of Fortune 1000 companies, exhibited at the 16th CIC National Credit Conference, hosted by the Credit Institute of Canada (CIC). The conference was held June 9-12, 2015 at the Fairmont Le Château Frontenac in Quebec City. The conference was attended by over 300 credit and AR professionals as they spent their time networking, engaging, and learning about the most current trends in the field.
HighRadius exhibited its end-to-end suite of Artificial Intelligence-powered technology solutions focused on driving efficiency into business processes in the accounts receivable and payments functions. In a special announcement, HighRadius announced the launch of ‘The Best Minds in A/R’ contest at the conference. Over 100 credit, AR, and finance professionals and senior executives visited the HighRadius booth as they submitted their entries and ideas about the future of accounting and finance operations. Delegates also received a preview of the latest HighRadius products and technologies.
“We are amazed by how dramatically the technology on display can positively impact the efficiency of finance and accounting operations. Automation is definitely going to be a key enabler for business and I am keen to learn more,” noted a credit supervisor with a large apparel manufacturer after visiting the HighRadius exhibit. “It has been a great experience interacting with professionals from all over Canada who are looking to bring improvements in existing systems and practices,” said Jay Tchakarov, AVP, Product Management at HighRadius. “We are exhilarated by the resounding acceptance of Artificial Intelligence in automating manual tasks and refocusing resource on high-impact decision making.”
To learn more about HighRadius and the benefits of credit and AR automation, visit
www.HighRadius.com.
